Effect of thermomechanical treatments on microstructure and properties of Cu-base leadframe alloy

Author: Ryu H.J.   Baik H.K.   Hong S.H.  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.35, Iss.14, 2000-07, pp. : 3641-3646

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Abstract