Functionally graded materials by electrochemical processing and infiltration: application to tungsten/copper composites

Author： Jedamzik R.   Neubrand A.   Rödel J.  

Publisher： Springer Publishing Company

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.35, Iss.2, 2000-01, pp. : 477-486

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