Effects of heat treatment at 350°C on the adhesion of Cu-Cr alloy films to polyimide

Author: Ahn E.C.   Yu J.   Park I.S.  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.35, Iss.8, 2000-04, pp. : 1949-1955

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Abstract