Copper deposition by Dynamic Chemical Plating

Author: Stremsdoerfer G.   Ghanem F.   Saikali Y.   Fares-Karam A.  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.38, Iss.15, 2003-08, pp. : 3285-3291

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract