Effects of molybdenum, silver dopants and a titanium substrate layer on copper film metallization

Author： Ko Y.K.   Jang J.H.   Lee S.   Yang H.J.   Lee W.H.   Reucroft P.J.   Lee J.G.  

Publisher： Springer Publishing Company

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.38, Iss.2, 2003-01, pp. : 217-222

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