Degradation of the Au₄Al compound in gold ballbonds during isothermal aging in air at 175 °C

Author： Breach C. D. Tok C. W. Wulff F. Calpito D.

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.39, Iss.19, 2004-10, pp. : 6125-6128

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Correlation of intermetallic compound growth behavior and melt state of Sn-3.5Ag-3.5Bi/Cu joint during soldering and isothermal aging

By Li Xiaoyun

Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 4, 2013-04 ,pp. : 1231-1237

Springer Publishing Company

Access to resources Recommend Favorite

Development of Fe₃C, SiC and Al₄C₃ compounds during mechanical alloying

By Enayati M. Seyed-Salehi M. Sonboli A.

Journal of Materials Science, Vol. 42, Iss. 15, 2007-08 ,pp. : 5911-5914

Springer Publishing Company

Access to resources Recommend Favorite

Preparation and characterization of AlVO₄ compound

By Arisi E. Sánchez S. A. Palomares Leccabue F. Watts B. E. Bocelli G. Calderón F. Calestani G. Righi L.

Journal of Materials Science, Vol. 39, Iss. 6, 2004-03 ,pp. : 2107-2111

Springer Publishing Company

Access to resources Recommend Favorite

Evolution of Microstructure in Semi-Solid of Al-2wt%Si-0.5wt%Mg and Al-4wt%Si-05wt% Alloys during Isothermal Holding

Advanced Materials Research, Vol. 2014, Iss. 1082, 2015-02 ,pp. : 152-166

Trans Tech Publications

Access to resources Recommend Favorite

Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

By Yoon Jeong-Won Jung Seung-Boo

Journal of Materials Science, Vol. 39, Iss. 13, 2004-07 ,pp. : 4211-4217

Springer Publishing Company

Access to resources Recommend Favorite