Author: Choi S. J. Park H. C. Stevens R.
Publisher: Springer Publishing Company
ISSN: 0022-2461
Source: Journal of Materials Science, Vol.39, Iss.3, 2004-02, pp. : 1037-1040
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract