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Formation of bulk Cu₆Sn₅ intermetallic compounds in Sn–Cu lead-free solders during solidification

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Correlation of intermetallic compound growth behavior and melt state of Sn-3.5Ag-3.5Bi/Cu joint during soldering and isothermal aging

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The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)₆Sn₅ compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

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Solid state intermetallic compound layer growth between Sn-8Zn-3Bi solder and bare copper substrate

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