Brazing Si3N4 ceramic using a Cu–Pd–Ti filler alloy for high-temperature applications

Author: Zhang J.   Naka M.   Zhou Y.  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.39, Iss.9, 2004-05, pp. : 3159-3161

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract