Role of trace elements on tensile behavior of accumulative roll-bonded pure copper

Author: Jang Younghwan   Kim Sangshik   Han Seungzeon   Lim Chayong   Kim Changjoo   Goto Masahiro  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.40, Iss.13, 2005-07, pp. : 3527-3529

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract