Sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films

Author: Chan Kah-Yoong   Teo Bee-San  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.40, Iss.22, 2005-11, pp. : 5971-5981

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content