Water-soluble binder with high flexural modulus for powder injection molding

Author： Song Minseok   Park Min   Kim Jin   Cho Il   Kim Kyung   Sung Hwan   Ahn Sangho  

Publisher： Springer Publishing Company

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.40, Iss.5, 2005-03, pp. : 1105-1109

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