Moisture effect on fracture strength of molding compounds (MCs) for electronic packaging in a wide temperature range

Author: Zhu W.   Ang Sharry   Gan S.  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.40, Iss.6, 2005-03, pp. : 1533-1537

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract