Analysis of fluid film formation between contacting compliant solids

By Ikeuchi K.   Fujita S.   Ohashi M.  

Tribology International, Vol. 31, Iss. 10, 1998-10 ,pp. : 613-618

Elsevier

Access to resources Recommend Favorite

Plane-stress asymptotic fields for interface crack between elastic and pressure-sensitive dilatant materials

By Yu H.   Wu Y.-L.   Li G.  

Engineering Fracture Mechanics, Vol. 60, Iss. 2, 1998-05 ,pp. : 205-219

Elsevier

Access to resources Recommend Favorite

Characterization of composite particles responsive to electric and magnetic fields *

By Zhao Xiaopeng   Guo Hongxia  

Progress in Natural Science, Vol. 14, Iss. 10, 2004-10 ,pp. : 912-916

Taylor & Francis Ltd

Access to resources Recommend Favorite

Relationship between structure, segregation and electrical activity in grain boundaries

By Lamzatouar A.   Palais O.   Duparc O.   Thibault J.   Charaï A.  

Journal of Materials Science, Vol. 40, Iss. 12, 2005-06 ,pp. : 3163-3167

Springer Publishing Company

Access to resources Recommend Favorite

Singular antiplane stress fields for bonded and disbonded three-material junctions

By Pageau S.S.   Joseph P.F.   Biggers S.B.  

Engineering Fracture Mechanics, Vol. 52, Iss. 5, 1995-11 ,pp. : 821-832

Elsevier

Access to resources Recommend Favorite