

Author: Liu Jun Gao Ji Cheng Ji Yang Jian Qiao Guan
Publisher: Springer Publishing Company
ISSN: 0022-2461
Source: Journal of Materials Science, Vol.42, Iss.15, 2007-08, pp. : 6148-6152
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Abstract
Micropipes are very harmful for SiC devices. Even one micropipe in the active area can destroy a high-voltage SiC device. Therefore, it is necessary to reduce the density of micropipes in SiC single crystals. In the present paper, we proposed methods for reducing micropipes. Restriction of screw dislocations and decrease of inclusions are the key factors to reduce the number of micropipes. (0 0 0 1) Si-face,
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