Diffusion bonding of Ti3AlC2 ceramic via a Si interlayer

Author: Yin X.   Li M.   Li T.   Zhou Y.  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.42, Iss.17, 2007-09, pp. : 7081-7085

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract