Quantitative evaluation of high temperature deformation mechanisms: a specific microgrid extensometry technique coupled with EBSD analysis

Author： Soula A.   Locq D.   Boivin D.   Renollet Y.   Caron P.   Bréchet Y.  

Publisher： Springer Publishing Company

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.45, Iss.20, 2010-10, pp. : 5649-5659

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