Author: Wang Hui Lan Yucheng Crimp Martin Lin C. Shukla Nitin Zeng Taofang Wang Dezhi Li Kecheng Ren Zhifeng Chen Gang
Publisher: Springer Publishing Company
ISSN: 0022-2461
Source: Journal of Materials Science, Vol.47, Iss.16, 2012-08, pp. : 5946-5954
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