Interfacial characterization and thermal conductivity of diamond/Cu composites prepared by two HPHT techniques

Author: Chen Hui   Jia Chengchang   Li Shangjie  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.47, Iss.7, 2012-04, pp. : 3367-3375

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Abstract