Measurement of Solder/Copper Interfacial Thermal Resistance by the Flash Technique

Author: Bai J.   Zhang Z.   Lu G.-Q.   Hasselman D.  

Publisher: Springer Publishing Company

ISSN: 0195-928X

Source: International Journal of Thermophysics, Vol.26, Iss.5, 2005-09, pp. : 1607-1615

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Abstract