Heat Transfer in Fast Linear Annealing for Direct Bonding of SOI Wafer Pairs

Author: Joo Youngcheol   Song Oh-Sung  

Publisher: Springer Publishing Company

ISSN: 0195-928X

Source: International Journal of Thermophysics, Vol.27, Iss.1, 2006-01, pp. : 314-331

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract