Crack-free, thick rhodium deposition on copper substrate using Rhodex solution

Author: Sadeghi M.   Afarideh H.   Aardaneh K.   Kiyomarsi M.   Mirzaii M.  

Publisher: Springer Publishing Company

ISSN: 0236-5731

Source: Journal of Radioanalytical and Nuclear Chemistry, Vol.265, Iss.3, 2005-08, pp. : 455-458

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