Author: Zhang S. Zhu N. Liu Y. Xie L.
Publisher: Springer Publishing Company
ISSN: 0306-8919
Source: Optical and Quantum Electronics, Vol.38, Iss.8, 2006-06, pp. : 675-682
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Wafer Bonding Techniques for Microsystem Packaging
Journal of Physics: Conference Series , Vol. 34, Iss. 1, 2006-04 ,pp. :
Velocity magnitude estimation with linear arrays using Doppler bandwidth
By Tortoli P. Guidi G. Mantovani
Ultrasonics, Vol. 39, Iss. 3, 2001-04 ,pp. :