Thermo-Mechanical Failure Criterion at the Micron Scale in Electronic Devices

Author： Yosibash Z.   Adan O.   Schneck R.   Atlas H.  

Publisher： Springer Publishing Company

ISSN： 0376-9429

Source： International Journal of Fracture, Vol.122, Iss.1-2, 2003-07, pp. : 47-64

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