A thermomechanical fracture modeling and simulation for functionally graded solids using a residual-strain formulation

Author: Anandakumar Ganesh   Kim Jeong-Ho  

Publisher: Springer Publishing Company

ISSN: 0376-9429

Source: International Journal of Fracture, Vol.164, Iss.1, 2010-07, pp. : 31-55

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Abstract