Semi-abrasive free slurry with acid colloidal silica for copper chemical mechanical planarization

Author: Kim Nam-Hoon   Lim Jong-Heun   Kim Sang-Yong   Chang Eui-Goo  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.16, Iss.9, 2005-09, pp. : 629-632

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Abstract