Electrodeposition of Cu from acidic sulphate solutions in the presence of polyethylene glycol and chloride ions

Author: Bozzini B.   D’Urzo L.   Mele C.   Romanello V.  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.17, Iss.11, 2006-11, pp. : 915-923

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