Effects of filler shape and size on the properties of silver filled epoxy composite for electronic applications

Author: Suriati G.   Mariatti M.   Azizan A.  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.22, Iss.1, 2011-01, pp. : 56-63

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content