Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives

Author: Ho Li-Ngee   Wu Teng   Nishikawa Hiroshi   Takemoto Tadashi   Miyake Koichi   Fujita Masakazu   Ota Koyu  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.22, Iss.7, 2011-07, pp. : 735-740

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