Barrier/bonding layers on bismuth telluride (Bi2Te3) for high temperature thermoelectric modules

Author: Lin Wen   Wesolowski Daniel   Lee Chin  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.22, Iss.9, 2011-09, pp. : 1313-1320

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