Heat Transfer at the Metal/Substrate Interface During Solidification of Pb-Sn Solder Alloys

Author： Prabhu K. Narayan   Kumar S.T.   Venkataraman N.  

Publisher： Springer Publishing Company

ISSN： 1059-9495

Source： Journal of Materials Engineering and Performance, Vol.11, Iss.3, 2002-06, pp. : 265-273

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