Influence of a Flux of High‐Velocity Microparticles on the Parameters of Integrated Circuits Placed Behind a Thick‐Walled Obstacle

Author: Belous A. I.   Dybov O. A.   Romanov G. S.   Petlitskaya T. V.   Usov G. I.  

Publisher: Springer Publishing Company

ISSN: 1062-0125

Source: Journal of Engineering Physics and Thermophysics, Vol.77, Iss.4, 2004-07, pp. : 773-775

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