Liquid Cooling of Electronic Devices by Single-phase Convection (Wiley —Interscience Publication, 1999, New York — Chichester — Weinheim — Brisbane — Singapore — Toronto) Frank P. Incropera

Author： Réti F.  

Publisher： Springer Publishing Company

ISSN： 1388-6150

Source： Journal of Thermal Analysis and Calorimetry, Vol.58, Iss.3, 1999-12, pp. : 749-749

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

V. Balzano (ed), Electron transfer in chemistry, vols. 1–5.: WILEY-VCH, Weinheim, New York, Chichester, Brisbane, Singapore, Toronto, 2001, 3912 p (ISBN 3-527-29912-2), €1599.00

By Scholz F.  

Journal of Solid State Electrochemistry, Vol. 8, Iss. 2, 2004-01 ,pp. : 139-140

Springer Publishing Company

Access to resources Recommend Favorite

Impedance spectroscopy [E. Barsoukov and J.R. Macdonald (Eds.)]: WILEY-INTERSCIENCE, Chichester, 2005, 595 + XVII p., 77.95 £; ISBN 0-471-64749-7

By  

Journal of Solid State Electrochemistry, Vol. 12, Iss. 5, 2008-05 ,pp. : 651-653

Springer Publishing Company

Access to resources Recommend Favorite

Bioinformatics: A Practical Guide to the Analysis of Genes and Proteins - Edited by A.D. Baxevanis, B.F.F. Ouellette, second ed., Wiley Interscience, New York, 2001. ISBN 0-471-38391-0, 470 pp.

By Risler J.-L.  

Computers and Chemistry, Vol. 26, Iss. 5, 2002-07 ,pp. : 549-551

Elsevier

Access to resources Recommend Favorite

Comparative Effectiveness of Different Phase Change Materials to Improve Cooling Performance of Heat Sinks for Electronic Devices

By Hasan Ahmad   Hejase Hassan   Abdelbaqi Shaimaa   Assi Ali   Hamdan Mohammed O.  

Applied Sciences, Vol. 6, Iss. 9, 2016-08 ,pp. : 226-226

MDPI

Access to resources Recommend Favorite

W. Ekardt (ed): Metal clusters. (Wiley Series in Theoretical Chemistry): Wiley, Chichester, 1999. 286 pp (ISBN 0-471-98783-2) US$ 85

By Langel W.  

Journal of Solid State Electrochemistry, Vol. 5, Iss. 3, 2001-04 ,pp. : 227-227

Springer Publishing Company

Access to resources Recommend Favorite