Designing low-thermal-expansivity, high-conductivity alloys in the Cu-Fe-Ni ternary system

Author: Jain R.   Cottle R.   Chen X.   Eliezer Z.   Rabenberg L.   Fine M.  

Publisher: Springer Publishing Company

ISSN: 1543-1851

Source: JOM, Vol.50, Iss.6, 1998-06, pp. : 67-69

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Abstract