Materials challenges in interconnection: Trade-offs for rapid deployment

Author： Frutschy Kris   Fu Zezhong   Goyal Deepak   Kinsman Ken   Samuelson Gay   Vogt Ryan  

Publisher： Springer Publishing Company

ISSN： 1543-1851

Source： JOM, Vol.51, Iss.3, 1999-03, pp. : 19-21

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