Electrochemical characterization of copper deposited on plasma and thermally modified titanium surfaces

Author： Teng K.   Delplancke J.   Zhang J.   O’Keefe T.  

Publisher： Springer Publishing Company

ISSN： 1543-1916

Source： Metallurgical and Materials Transactions B, Vol.29, Iss.4, 1998-08, pp. : 749-754

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