Directional Solidification in a AgCuSn Eutectic Alloy

Author： Schaefer Robert J. Lewis Daniel J.

ISSN： 1543-1940

Source： Metallurgical and Materials Transactions A, Vol.36, Iss.10, 2005-10, pp. : 2775-2783

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Ag₃Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

By Kang Sung Shih Da-Yuan Donald NY. Henderson W. Gosselin Timothy Sarkhel Amit Charles Goldsmith NY. Puttlitz Karl Choi Won

JOM, Vol. 55, Iss. 6, 2003-06 ,pp. : 61-65

Springer Publishing Company

Access to resources Recommend Favorite

Accurately determining eutectic compositions: The Sn-Ag-Cu ternary eutectic

By Moon K. Boettinger W.

JOM, Vol. 56, Iss. 4, 2004-04 ,pp. : 22-27

Springer Publishing Company

Access to resources Recommend Favorite

Dynamic viscosities of pure tin and Sn-Ag, Sn-Cu, and Sn-Ag-Cu eutectic melts

By Rozhitsina E. Gruner S. Kaban I. Hoyer W. Sidorov V. Popel' P.

Russian Metallurgy (Metally), Vol. 2011, Iss. 2, 2011-02 ,pp. : 118-121

MAIK Nauka/Interperiodica

Access to resources Recommend Favorite

Controlling Ag₃Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying

By Kang Sung Shih Da-Yuan Leonard Donovan Henderson Donald Gosselin Timothy Cho Sung-il Yu Jin Choi Won

JOM, Vol. 56, Iss. 6, 2004-06 ,pp. : 34-38

Springer Publishing Company

Access to resources Recommend Favorite

Refinement Mechanism of Solidification Structure of Au-20Sn Eutectic Alloy by Different Solidification Techniques

Key Engineering Materials, Vol. 2018, Iss. 759, 2018-02 ,pp. : 24-28

Trans Tech Publications

Access to resources Recommend Favorite