Author: Luef Christoph Flandorfer Hans Ipser Herbert
Publisher: Springer Publishing Company
ISSN: 1543-1940
Source: Metallurgical and Materials Transactions A, Vol.36, Iss.5, 2005-05, pp. : 1273-1277
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
The orientation imaging microscopy of lead-free Sn-Ag solder joints
JOM, Vol. 57, Iss. 6, 2005-06 ,pp. :
Tensile Properties of Sn-Bi Lead-Free Solder Alloys
Solid State Phenomena, Vol. 2018, Iss. 273, 2018-06 ,pp. :