Investigation of recrystallization and grain growth of copper and gold bonding wires

Author: Cho Jae-Hyung   Oh K.   Rollett A.   Cho J.   Park Y.   Moon J.  

Publisher: Springer Publishing Company

ISSN: 1543-1940

Source: Metallurgical and Materials Transactions A, Vol.37, Iss.10, 2006-10, pp. : 3085-3097

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract