Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System

ISSN： 1543-1940

Source： Metallurgical and Materials Transactions A, Vol.42, Iss.4, 2011-04, pp. : 952-963

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Response Surface Modeling and Evaluation of the Influence of Deposition Parameters on the Electrolytic Cu-Sn Alloy Powders Production

By Orhan Gökhan

Metallurgical and Materials Transactions B, Vol. 42, Iss. 4, 2011-08 ,pp. : 771-782

Springer Publishing Company

Access to resources Recommend Favorite

Use of response surface methodology for evaluation of effective parameters in codeposition of Cu-Sn alloys using non-cyanide electroplating solution

By Asnavandi M Ghorbani M

Transactions of the Institute of Metal Finishing, Vol. 90, Iss. 1, 2012-01 ,pp. : 38-43

Maney Publishing

Access to resources Recommend Favorite

On the Ce-Cu-Sn System

By Riani P. Mazzone D. Zanicchi G. Marazza R. Ferro R. Faudot F. Harmelin M.

Journal of Phase Equilibria, Vol. 19, Iss. 3, 1998-06 ,pp. : 239-251

Springer Publishing Company

Access to resources Recommend Favorite

On the Ce-Cu-Sn system

By Riani P. Mazzone D. Zanicchi G. Marazza R. Ferro R. Faudot F. Harmelin M.

Journal of Phase Equilibria & Diffusion, Vol. 19, Iss. 3, 1998-06 ,pp. : 239-251

Springer Publishing Company

Access to resources Recommend Favorite

Formation of Intermediate Phases and Supersaturated Solid Solution in Al-Cu System during Diffusion

Defect and Diffusion Forum, Vol. 2018, Iss. 383, 2018-03 ,pp. : 31-35

Trans Tech Publications

Access to resources Recommend Favorite