Diffusion Bonding of Microduplex Stainless Steel and Ti Alloy with and without Interlayer: Interface Microstructure and Strength Properties

Author： Kundu S. Sam S. Mishra B. Chatterjee S.

Publisher： Springer Publishing Company

ISSN： 1543-1940

Source： Metallurgical and Materials Transactions A, Vol.45, Iss.1, 2014-01, pp. : 371-383

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