Influences of grain structure on thermally induced stresses in 3D IC inter-wafer vias

Author: Bentz D.   Bloomfield M.   Lu J.-Q   Gutmann R.   Cale T.  

Publisher: Springer Publishing Company

ISSN: 1569-8025

Source: Journal of Computational Electronics, Vol.5, Iss.4, 2006-12, pp. : 327-331

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Abstract