Interface Morphology Between the Aluminide Layer and Iron Substrate in the Hot-Dip Aluminizing Process

Author: Kwon S. C.   Lee J. Y.  

Publisher: Maney Publishing

ISSN: 0008-4433

Source: Canadian Metallurgical Quarterly, Vol.20, Iss.3, 1981-07, pp. : 351-357

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Abstract