A Three-Dimensional Study of Electronic Component Cooling Using a Flat Heat Pipe

Author: Hassan Hamdy   Harmand Souad  

Publisher: Taylor & Francis Ltd

ISSN: 1521-0537

Source: Heat Transfer Engineering, Vol.34, Iss.7, 2013-01, pp. : 596-607

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract