Electrospun Nanopaper and its Applications to Microsystems

Author: Lingaiah Shivalingappa   Shivakumar Kunigal   Sadler Robert  

Publisher: Taylor & Francis Ltd

ISSN: 1550-2287

Source: International Journal for Computational Methods in Engineering Science and Mech, Vol.15, Iss.1, 2014-01, pp. : 2-8

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

A new method of preparing Nylon-66 nanopaper using electrospun nonwoven nanofiber and fiber fusing is presented. The fusing temperature for Nylon-66 nanofiber was found to be 190°C. Both carbon and glass fiber reinforced nanopapers were prepared. The unreinforced Nylon-66 nanopaper of areal density 4.5 g/m2 had a modulus and strength of 681 MPa and 92.8 MPa, respectively, while the unfused nanopaper had 430 MPa and 59.3 MPa, respectively. This increase was attributed to fusing of randomly oriented fibers. Several types of insect wings, namely FlyTech dragonfly and Deadalus flight system wings, were fabricated and tested for their flyability. Vibration test was conducted to measure the wing stiffness by matching the measured first natural frequency to the stiffness.