Electrically Conductive Adhesives for Electronic Packaging and Assembly Applications

Author： Matienzo L. J.   Das R. N.   Egitto F. D.  

Publisher： Taylor & Francis Ltd

ISSN： 1568-5616

Source： Journal of Adhesion Science and Technology, Vol.22, Iss.8-9, 2008-06, pp. : 853-869

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