The Sintering Behavior of Electrically Conductive Adhesives Filled with Surface Modified Silver Nanowires

By Zhang Z. X.  

Journal of Adhesion Science and Technology, Vol. 25, Iss. 13, 2011-08 ,pp. : 1465-1480

Taylor & Francis Ltd

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Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles

By Lin Yung-Sen  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 14, 2008-09 ,pp. : 1673-1697

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Sintering behavior and effect of silver nanoparticles on the resistivity of electrically conductive adhesives composed of silver flakes

By Xiong Nana   Wang Meina   Zhang Hanping   Xie Hui   Zhao Yuzhen   Wang Yuehui   Li Jingze  

Journal of Adhesion Science and Technology, Vol. 28, Iss. 24, 2014-12 ,pp. : 2402-2415

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Electrically Conductive Adhesives for Electronic Packaging and Assembly Applications

By Matienzo L. J.   Das R. N.   Egitto F. D.  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 8-9, 2008-06 ,pp. : 853-869

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Drop Test Performance of Isotropic Electrically Conductive Adhesives

By Morris James E.  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 14, 2008-09 ,pp. : 1699-1716

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