Ultrasonic bonding of Cu/Ni and its thermal reliability

Author： Tanaka Yo   Fujiwara Shinichi   Ogura Tomo   Sano Tomokazu   Hirose Akio  

Publisher： Taylor & Francis Ltd

ISSN： 0950-7116

Source： Welding International, Vol.29, Iss.4, 2015-04, pp. : 270-278

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