Publisher: IOP Publishing
ISSN: 1757-899X
Source: IOP Conference Series: Materials Science and Engineering, Vol.63, Iss.1, 2014-08, pp. : 1144-1149
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Microstructure and Interconnections Characteristics of Titanium Foam
Key Engineering Materials, Vol. 2016, Iss. 687, 2016-05 ,pp. :
Microstructure and Properties of the Composite on the Basis of Copper and Diamond
Key Engineering Materials, Vol. 2016, Iss. 685, 2016-03 ,pp. :