Publisher: IOP Publishing
ISSN: 1757-899X
Source: IOP Conference Series: Materials Science and Engineering, Vol.70, Iss.1, 2015-01, pp. : 43-46
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Electric Multi-Module Catapult Dynamics
Solid State Phenomena, Vol. 2015, Iss. 220, 2015-01 ,pp. :
W-Band Quadrupler Based on Multi-Chip Module and Schottky Barrier Diodes
Key Engineering Materials, Vol. 2015, Iss. 645, 2015-06 ,pp. :
Multi-Chip Module Design of a MEMS Air Pressure Sensor
Key Engineering Materials, Vol. 2015, Iss. 645, 2015-06 ,pp. :